XC3S1200E-4FTG256C

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XC3S1200E-4FTG256C

IC FPGA 190 I/O 256FTBGA

  • Nhà sản xuất
  • Ông. Phần #XC3S1200E-4FTG256C
  • Gói BGA-256
  • Bảng dữ liệu
  • Có sẵn3396

100% gốc & amp; Mới

24 giờ sẵn sàng để vận chuyển

Bảo hành 365 ngày

RFQ & amp; Nhận thêm Giảm giá

Thông số kỹ thuật

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 2168
NumberofLogicElements/Cells 19512
TotalRAMBits 516096
NumberofI/O 190
NumberofGates 1200000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 256-LBGA

Tổng quan

Description

The XC3S1200E-4FTG256C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3E series. It features 1,200 logic cells, making it suitable for a range of applications, including digital signal processing, embedded systems, and various prototyping tasks.
This FPGA operates at a maximum clock frequency of 250 MHz and provides a range of configurable I/O options, supporting various voltage levels and standards. The device is housed in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, which allows for compact design in space-constrained applications.
With a built-in 4Kbit block RAM and support for multiple serial and parallel interfaces, the XC3S1200E is ideal for designs that require flexibility and scalability. It also supports a variety of development tools from Xilinx, enabling users to efficiently design, simulate, and implement their applications. Overall, it offers a balance of performance, power efficiency, and design versatility for both hobbyists and professionals in electronics design.

Features

The XC3S1200E-4FTG256C is a Spartan-3E FPGA (Field Programmable Gate Array) from Xilinx. Key features include:
1. Logic Cells: Approximately 1,200 logic cells, providing a balance of performance and resource availability for various applications.
2. I/O Pins: 256 I/O pins with support for various I/O standards, enabling extensive interfacing capabilities.
3. Memory: Includes block RAM resources for data storage and processing, enhancing design flexibility.
4. DSP Slices: Integrated DSP slices for high-performance arithmetic operations, beneficial for signal processing tasks.
5. Configuration: Configurable through various methods, including JTAG, allowing for easy programming and updates.
6. Low Power: Designed for low power consumption, suitable for portable and battery-operated devices.
7. Development Tools: Supported by Xilinx's ISE (Integrated Software Environment) for design implementation and simulation.
8. Applications: Ideal for communications, automotive, consumer electronics, and industrial applications.
Overall, the XC3S1200E-4FTG256C offers a blend of performance, flexibility, and power efficiency for diverse electronic designs.

Package

The XC3S1200E-4FTG256C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 256 balls. This type of package provides a compact design and efficient thermal management for the Spartan-3E FPGA.

Pinout

The XC3S1200E-4FTG256C is a Spartan-3E FPGA from Xilinx. It has a pin count of 256.
The device features a variety of functionalities, including:
- Configurable logic blocks (CLBs) for implementing logic functions.
- Digital signal processing (DSP) slices for efficient arithmetic operations.
- Memory blocks for RAM and FIFO implementations.
- I/O blocks supporting various signaling standards, including LVTTL, LVCMOS, and SSTL.
- Clock management features such as phase-locked loops (PLLs) and clock dividers.
This FPGA is suitable for applications in communications, automotive, industrial, and consumer electronics, offering a balance between performance and power efficiency.

Manufacturer

The manufacturer of the XC3S1200E-4FTG256C is Xilinx, Inc., which is a prominent American technology company. Xilinx specializes in field-programmable gate arrays (FPGAs), programmable system-on-chip (SoC) devices, and other related technologies. Their products are widely used in various applications including telecommunications, automotive, industrial, and consumer electronics. Founded in 1984, Xilinx pioneered the FPGA market, enabling designers to create custom hardware configurations after the manufacturing process, offering flexibility and adaptability in electronic design. The company focuses on innovation and has been at the forefront of advancements in programmable logic devices. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor industry.

Application

The XC3S1200E-4FTG256C is a Spartan-3E FPGA commonly used in applications such as digital signal processing, embedded systems, communications, automotive electronics, industrial control, and consumer electronics. Its versatility allows for customizable logic functions, making it suitable for prototyping, image processing, and real-time data handling in various fields.

Equivalent

The XC3S1200E-4FTG256C is a Spartan-3E FPGA. Equivalent products include:
1. XC3S1200-4FTG256 - Non-ECC version.
2. Xilinx Artix-7 series (e.g., XA7A100T-1FGG484).
3. Lattice ECP5 series (e.g., LFE5U-85F-6BG381C).
4. Altera Cyclone III (e.g., EP3C120F484C6).
These alternatives vary in capabilities, so consider application requirements when selecting.

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