W25Q256FVFIQ

W25Q256FVFIQ is a Winbond 256‑Mbit serial NOR flash memory. It provides SPI‑compatible storage for firmware and data in embedded systems, with modes that include Standard SPI, Dual I/O, and Quad I/O (QPI) for higher throughput.
Key points:
- Capacity: 256 Mbit (32 MB)
- Memory organization: 4 KB sectors, 64 KB blocks; 256‑byte page size for programming
- Interfaces and performance: supports standard, fast, dual I/O, and quad I/O read; enables faster throughput in Quad I/O modes
- Operations: page program (up to 256 bytes), sector erase (4 KB), block erase (64 KB), chip erase; supports deep power‑down and hardware reset
- Security and protection: block protection and write protection features; device/manufacturer ID and security registers
- Voltage and temp: typically operates at 2.7–3.6 V; temperature grades available (industrial variants)
- Applications: firmware storage, boot memory, code execution/storage in embedded systems
Check the exact variant’s datasheet (packaging, voltage, and temperature grade) to confirm details for your design.

W25Q256FVFIQ features (concise):
- 256 Mbit (32 Mbyte) serial flash memory
- Voltage: 2.7–3.6 V (single-supply)
- Industrial temperature range: -40°C to 85°C
- SPI interface with Dual I/O and Quad I/O (DQ) support
- 4-byte addressing mode for full 32 MB address space
- Memory organization: 256-byte page; 4 KB sectors; 32 KB and 64 KB blocks; chip erase
- Read speeds: up to Quad I/O at ~104 MHz (standard SPI up to high tens of MHz)
- Endurance: typically ~100,000 program/erase cycles; data retention ~20 years
- Power modes: Deep Power-Down; fast wake-up
- Security and protection: write enable, block/protected regions, status register, 64-bit unique ID
- Package: 8-pin device (suitable for small form factors)
Note: speeds and exact packaging/grade specifics may vary by exact variant; this summarizes common features of W25Q256FVFIQ.

8-pin SOP (Small Outline Package) package.

- Pin count: 8 pins (8-pin package, e.g., 8-pin SOP).
- Function: 256-Mbit serial NOR flash memory (Winbond W25Q256FV family) with SPI/QPI interface for non-volatile storage of firmware and data, supporting standard read/write/erase operations.

The W25Q256FVFIQ is manufactured by Winbond Electronics Corporation. Winbond is a Taiwanese semiconductor company that specializes in memory ICs, including NOR and NAND flash (and related memory products) for global electronics markets.

W25Q256FVFIQ is a 256-Mbit SPI flash (Quad I/O) used as external non-volatile storage. Typical applications:
- Firmware/boot flash for microcontrollers and SoCs
- External code/data storage for embedded controllers in consumer electronics, networking gear, printers
- In-field firmware updates and recovery
- Parameter/configuration storage and data logging in IoT, industrial, automotive devices
- OS/images storage and caching for compact systems

Equivalent (256-Mbit, 3.3V SPI Flash) cross references:
- GD25Q256C/D (Gigadevice)
- MX25L25645G (Macronix)
- IS25LP256D/M (ISSI)
- S25FL256S (Spansion/Cypress)
- EN25QH256A (Etron)
- P25Q256H (Puya)
Note: verify exact voltage, package, and Quad/OPI support for your design.