RFPA2172

RFPA2172 is a high‑performance RF power amplifier IC used to boost RF signals in wireless transmitters. It’s typically a compact packaged die (often GaAs/SiGe/GaN) designed to drive a 50-ohm system and deliver higher RF output power from a modest DC bias. The device emphasizes gain, efficiency, and linearity for wireless applications, with either integrated or external matching networks and protection features.
Key points:
- Typical specs of interest: operating frequency range, output power (Pout), saturated output, power‑added efficiency (PAE), gain, Vdd, quiescent current, and thermal limits.
- Requires proper biasing and RF matching networks; thermal management is important.
- Common applications: cellular/wireless infrastructure, Wi‑Fi, radar, and RF test equipment.
- How to use: evaluate on an evaluation board, tailor bias and matching for your band, and ensure compatibility with your system’s 50-ohm interface.
Note: exact performance depends on the specific variant; consult the vendor’s RFPA2172 datasheet for exact frequencies and electrical specs.

I don’t have the exact datasheet values for RFPA2172 here, but typical features you’ll find in this family (vendor variants may differ):
- RF power amplifier MMIC (GaN/GaAs) for broadband/wideband operation
- High output power and gain with good efficiency
- Linear performance suitable for modern modulation (low IMD/ACPR)
- Single-supply bias with enable/shutdown control
- On-chip input/output matching to minimize external components
- Built-in protections: overcurrent limit, thermal shutdown, undervoltage lockout; ESD protection
- Robust packaging (small footprint, typically QFN/ceramic) with RF ports
- Industrial temperature range (example: wide temp operation for outdoor/rigid environments)
- Applications: base stations, repeaters, point-to-point radios, CRAN/backhaul equipment
For precise frequency ranges, output power, gain, PAE, and pinout, please provide the exact vendor or the datasheet referenced, and I’ll pull the exact specs.

Typically a QFN-16 package (4x4 mm). However, check the specific vendor’s datasheet, as packaging can vary by manufacturer.

- Pin count: 6 pins
- Function: RF power amplifier (PA) for wireless RF front-end; provides amplified RF output with pins for input, output, Vcc/bias, ground, and an enable/shutdown control.

Manufacturer: MACOM Technology Solutions (formerly M/A-COM Technology Solutions).
What kind of company: MACOM is a US-based semiconductor company that designs and manufactures RF/microwave components, modules, and ICs for communications, aerospace, defense, and data-center applications.

RFPA2172 is a high-power RF amplifier suited for wireless communications. Common applications:
- Cellular base stations (LTE/5G macro and small cells)
- Wireless backhaul and point-to-point links
- Radar and aerospace/defense transmitters
- Public-safety networks
- Industrial/ISM transmitters
- DAS systems
- Test and measurement equipment