K4AAG165WB-MCRC

The K4AAG165WB-MCRC is a type of DRAM (Dynamic Random Access Memory) module developed by Samsung. It is part of the K4A series, which is known for high-density and high-performance memory solutions. Specifically, the K4AAG165WB-MCRC is designed for use in advanced applications such as smartphones, tablets, and other mobile devices that require efficient memory performance.
Key features include a low power consumption profile, which is crucial for battery-operated devices, and support for high-speed data transfer rates, enhancing overall system performance. The module typically operates at 1.8V and is compliant with various industry standards, ensuring compatibility across different platforms.
This DRAM is particularly notable for its ability to support multitasking and demanding applications, making it ideal for modern computing environments where quick data access and processing are essential. Overall, the K4AAG165WB-MCRC represents a blend of efficiency and performance, catering to the growing demands of mobile technology.

The K4AAG165WB-MCRC is a DDR3 SDRAM memory chip with the following key features:
1. Technology: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic RAM).
2. Capacity: 2GB capacity per chip.
3. Data Rate: Operates at a data rate of 1.6 Gbps, supporting high-speed performance.
4. Organization: Typically organized as 1x16 bits, allowing for efficient data handling.
5. Voltage: Operates at a low voltage of 1.5V, contributing to power efficiency.
6. Package: Available in a standard FBGA (Fine Ball Grid Array) package, facilitating compact designs.
7. Features: Supports burst lengths of 8, with on-die termination (ODT) for improved signal integrity.
8. Applications: Commonly used in laptops, desktops, and other computing devices requiring reliable memory solutions.
This combination of features makes the K4AAG165WB-MCRC suitable for a wide range of applications requiring efficient and high-performance memory.

The K4AAG165WB-MCRC is a DRAM memory chip packaged in a 96-ballFBGA (Fine Ball Grid Array) format. This packaging type provides a compact design suitable for high-density applications.

The K4AAG165WB-MCRC is a DRAM chip from Samsung, specifically a DDR4 SDRAM. It features a total of 96 pins. The primary function of this memory chip is to provide high-speed data storage and retrieval for various computing applications, including desktops, laptops, and servers. It supports a data rate of up to 2400 MT/s and operates at a voltage of 1.2V, making it energy-efficient while delivering improved performance compared to previous generations of DDR memory. The chip is designed with a x16 (16-bit) data width and conforms to JEDEC standards, ensuring compatibility with a wide range of devices.

The K4AAG165WB-MCRC is manufactured by Samsung Electronics. Samsung is a South Korean multinational conglomerate, widely recognized as one of the largest technology companies in the world. It operates in various sectors, including consumer electronics, semiconductors, telecommunications, and digital media. The company is particularly known for its advanced semiconductor manufacturing, producing memory chips and integrated circuits that are crucial for devices ranging from smartphones to data centers. Samsung Electronics is a subsidiary of the larger Samsung Group, which encompasses numerous affiliates involved in diverse industries.

The K4AAG165WB-MCRC is a 1GB DDR3 SDRAM chip commonly used in various applications, including mobile devices, embedded systems, automotive electronics, and consumer electronics. Its low power consumption and high-speed performance make it suitable for smartphones, tablets, and IoT devices, where efficient data processing and storage are essential.

The K4AAG165WB-MCRC chip is a 16Gb DDR4 SDRAM. Equivalent products include the Samsung K4AAG165WB-MCRC, Micron MT40A1G16CM-075E, and Hynix H5AN8G6NAFR-TF. Ensure compatibility with your specific application, as electrical and thermal characteristics may vary.