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IR2302STRPBF
IC GATE DRVR HALF-BRIDGE 8SOIC
- Nhà sản xuất
- Ông. Phần #IR2302STRPBF
- Gói SOIC 8N
- Bảng dữ liệu IR2302STRPBF DataSheet
- Có sẵn6963
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Thông số kỹ thuật
| Package | Tape & Reel (TR) |
| ProductStatus | Active |
| DrivenConfiguration | Half-Bridge |
| ChannelType | Synchronous |
| NumberofDrivers | 2 |
| GateType | IGBT, N-Channel MOSFET |
| Voltage-Supply | 5V ~ 20V |
| LogicVoltage-VILVIH | 0.8V, 2.9V |
| Current-PeakOutput(SourceSink) | 200mA, 350mA |
| InputType | Non-Inverting |
| HighSideVoltage-Max(Bootstrap) | 600 V |
| Rise/FallTime(Typ) | 130ns, 50ns |
| OperatingTemperature | -40°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
Tổng quan
Description
Key features of the IR2302STRPBF include:
1. Half-Bridge Driver: It is designed to drive a half-bridge configuration, which is commonly used in inverter and motor control applications.
2. Under-Voltage Lockout (UVLO): The device includes protection features like UVLO to safeguard against low-voltage conditions, ensuring reliable operation.
3. Bootstrap Circuitry: It supports bootstrap circuitry, which allows for the generation of the high-side drive voltage.
4. High-Speed Operation: The IC supports fast switching speeds, which are essential for efficient power conversion.
5. Compact and Efficient: It is packaged in a small form factor, making it suitable for space-constrained applications.
The IR2302STRPBF is widely used in applications such as motor drives, industrial inverters, and power supplies due to its reliability and efficiency in driving power transistors.
Features
1. Dual Output Channels: Capable of driving both high-side and low-side power MOSFETs or IGBTs.
2. High Voltage Range: Designed to work with high-voltage applications, supporting up to 600V.
3. Bootstrap Circuitry: Integrated bootstrap diodes support the high-side driver, facilitating efficient switching.
4. High-Speed Operation: Capable of fast switching speeds, enhancing the efficiency of power conversion.
5. Undervoltage Lockout (UVLO): Provides protection by preventing the gate driver from operating when the supply voltage is too low.
6. Low Propagation Delay: Ensures quick response times, which are crucial for high-frequency applications.
7. CMOS Schmitt-triggered Inputs: Offers better noise immunity, ensuring stable operation in noisy environments.
8. Logic-level Compatibility: Compatible with standard logic-level inputs, simplifying integration into various systems.
9. Thermal Protection: Built-in features to protect against overheating, increasing the reliability and lifespan of the device.
10. Compact Packaging: Available in SOIC-8 package, optimizing space-saving for PCB designs.
These features make the IR2302STRPBF suitable for various applications, including motor drives, power supplies, and inverter systems.
Package
Pinout
The IR2302STRPBF comes in an 8-pin configuration. Here's a brief overview of its pin functions:
1. VCC: Supply voltage for the IC.
2. VB: High-side floating supply voltage.
3. HO: High-side output, connected to the gate of the high-side MOSFET or IGBT.
4. HS: High-side source connection, used as the return path for the high-side driver.
5. VS: Return path for input logic signals. Connects the logic ground.
6. HIN: Logic input for controlling the high-side output.
7. LIN: Logic input for controlling the low-side output.
8. LO: Low-side output, connected to the gate of the low-side MOSFET or IGBT.
9. COM: Common ground for the low-side driver.
This configuration allows for independent control of the high and low-side switches in half-bridge applications, making it suitable for a wide range of power electronics applications.
Manufacturer
Application
Equivalent
1. IRS2302STRPBF (Infineon, similar functionality with potential variations in packaging or slight specs).
2. FAN7390 (ON Semiconductor, similar function and performance).
3. MIC4101 (Microchip Technology, similar high/low side MOSFET driver).
4. LM5101 (Texas Instruments, similar half-bridge driver).
Ensure to compare electrical characteristics and package specifications before substituting.
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