BGM111A256V2R

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BGM111A256V2R

RF TXRX MOD BLUETOOTH CHIP SMD

100% gốc & amp; Mới

24 giờ sẵn sàng để vận chuyển

Bảo hành 365 ngày

RFQ & amp; Nhận thêm Giảm giá

Thông số kỹ thuật

Part Status Active
RF Family/Standard Bluetooth
Protocol Bluetooth v4.2
Modulation GFSK
Frequency 2.4GHz
Data Rate 1Mbps
Power - Output 8dBm
Sensitivity -92dBm
Serial Interfaces I2C, SPI, UART
Antenna Type Integrated, Chip
Utilized IC / Part EFR32BG
Memory Size 256kB Flash, 32kB RAM
Voltage - Supply 1.85V ~ 3.8V
Current - Receiving 8.7mA
Current - Transmitting 8.2mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package / Case Module
Base Product Number BGM111
DigiKey Programmable Not Verified

Tổng quan

Description

The BGM111A256V2R is a wireless Bluetooth module developed by Silicon Labs, designed for low-power, short-range communication in IoT applications. It features a highly integrated design, combining a 32-bit ARM Cortex-M4 microcontroller, a Bluetooth 5.0 radio, and various peripherals, enabling efficient processing and connectivity.
Key specifications include 256 kB of RAM and 4 MB of flash memory, allowing for ample storage and running complex applications. The module supports various Bluetooth profiles, making it suitable for a range of applications, including smart home devices, wearables, and industrial automation.
Its low energy consumption and robust performance make it ideal for battery-powered devices. The BGM111A256V2R also includes development tools and an extensive Software Development Kit (SDK), facilitating rapid prototyping and development. Overall, this module offers a versatile solution for developers looking to integrate Bluetooth connectivity into their products.

Features

The BGM111A256V2R is a Bluetooth Low Energy (BLE) module designed for IoT applications. Key features include:
1. Integrated Antenna: Simplifies designs by eliminating the need for an external antenna.
2. Low Power Consumption: Ideal for battery-operated devices, supporting ultra-low energy applications.
3. 256 KB Flash Memory: Provides ample space for firmware and application development.
4. Built-in Peripheral Interfaces: Supports various communication interfaces such as UART, I2C, and SPI, facilitating easy integration with other components.
5. Wide Operating Temperature Range: Suitable for diverse environmental conditions.
6. Compact Form Factor: Designed for space-constrained applications, making it ideal for wearables and small devices.
7. Software Development Kit (SDK): Comes with an SDK that aids developers in creating and deploying applications quickly.
8. Security Features: Supports secure connections and data transmission.
These features make the BGM111A256V2R a versatile choice for developers looking to implement Bluetooth connectivity in their projects.

Package

The BGM111A256V2R is packaged in a QFN (Quad Flat No-lead) with a 16-pin configuration, measuring 3mm x 3mm. This compact package type is designed for efficient thermal and electrical performance in wireless applications.

Pinout

The BGM111A256V2R is a Bluetooth Low Energy (BLE) module from Silicon Labs. It features a total of 22 pins.
The functions of these pins include:
- Power Supply: VDD (power input) and GND (ground).
- GPIO Pins: General-purpose input/output pins that can be configured for various functions, including digital I/O and ADC (analog-to-digital converter).
- UART Interface: TXD (transmit) and RXD (receive) pins for serial communication.
- I2C/SPI Interface: Pins for I2C (SDA, SCL) or SPI (depending on configuration).
- Reset Pin: A pin for resetting the module.
- Debug Pins: For debugging purposes.
- RF Antenna Connection: For wireless communication.
This module is designed for easy integration into IoT devices, offering a compact solution for BLE connectivity.

Manufacturer

The BGM111A256V2R is manufactured by Silicon Labs, a company known for its expertise in semiconductor solutions. Silicon Labs specializes in developing a wide range of products, including microcontrollers, wireless solutions, and sensors, primarily targeting the Internet of Things (IoT) market. Established in 1996, the company is recognized for its innovation in low-power, high-performance technologies that enable connectivity and efficiency in various applications. Their products are widely used in consumer electronics, industrial automation, and smart home devices, among others. Silicon Labs is headquartered in Austin, Texas, and is publicly traded on the NASDAQ under the ticker symbol SLAB.

Application

BGM111A256V2R is a Bluetooth Low Energy (BLE) module commonly used in Internet of Things (IoT) applications, wearables, smart home devices, medical devices, and industrial automation. Its low power consumption and compact size make it ideal for battery-operated devices requiring wireless connectivity and real-time data transmission.

Equivalent

The BGM111A256V2R is a Bluetooth Low Energy (BLE) SoC. Equivalent products include the Nordic Semiconductor nRF52832, Silicon Labs EFR32BG13, and Texas Instruments CC2640R2F. These alternatives provide similar BLE capabilities and features suitable for low-power applications. Always check specific datasheets for compatibility and performance details.

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Hãng DHL: Chi phí vận chuyển dao động từ $ 25- $ 45 (0,5kg), với thời gian giao hàng ước tính là 2-5 ngày làm việc.

FedEx: Chi phí vận chuyển dao động từ $ 25- $ 40 (0,5kg), với thời gian giao hàng ước tính là 3-7 ngày làm việc.

Sản phẩm UPS: Chi phí vận chuyển dao động từ $ 25- $ 45 (0,5kg), với thời gian giao hàng ước tính là 3-7 ngày làm việc.

TNT: Chi phí vận chuyển dao động từ $ 25- $ 65 (0,5kg), với thời gian giao hàng ước tính là 3-7 ngày làm việc.

EMS: Chi phí vận chuyển dao động từ $ 30- $ 50 (0,5kg), với thời gian giao hàng ước tính là 7-15 ngày làm việc.

Đăng ký Air Mail: Chi phí vận chuyển là $ 2- $ 4 (0.1kg), với thời gian giao hàng ước tính là 5-20 ngày làm việc.

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